| Not tied to any other specific silicon manufacturer, Densitron occupies a strong position to select the most appropriate driver and its associated mounting package specific for your application. This will broadly fall in line with one of the 6 types shown on this page.
* Gold bumped - small XY size
* Die only - very low cost
* Chip on board (COB) - low cost, low profile assembly
* Quad flat pack (QFP) - availability
* Tape carrier package (TCP) - Availability and ease of use with built in interconnection system
* Chip on flex (COF) - built in interconnection and possibility for mounting other discrete components
* Virtual chip on glass (VCOG) - low volume highly flexible electronic assembly
Example resolution QFP DIE GOLD TAB COF
|
| 1x8 (chars) |
v |
v |
|
|
|
| 1x16 (chars) |
v |
v |
v |
|
|
| 2x16 (chars) |
v |
v |
v |
|
|
| 4x12 (chars) |
v |
v |
v |
|
|
| 4x20 (chars) |
v |
v |
v |
v |
• |
| 16x96 (dots) |
|
v |
v |
v |
• |
| 32x96 (dots) |
|
v |
v |
v |
• |
| 32x100 (dots) |
|
v |
v |
v |
• |
| 33x102 (dots) |
|
v |
v |
v |
• |
| 32x128 (dots) |
|
v |
v |
v |
• |
| 32x132 (dots) |
|
v |
v |
v |
• |
| 64x100 (dots) |
|
v |
v |
v |
• |
| 64x128 (dots) |
|
v |
v |
v |
• |
| 32x256 (dots) |
|
v |
v |
v |
• |
| 65x132 (dots) |
|
v |
v |
v |
v |
| 100x160 (dots) |
|
v |
v |
v |
v |
|